Detection of ionic contamination under low-standoff components Part II

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[Freddy Gilbert, Dr. Helmut Schweigart]

This paper summarizes the second part of a study on extracting ionic contamination from unpopulated circuit boards and assemblies with low-standoff components. It evaluates ionic cleanliness in unpopulated boards and compares ion chromatography results between intact assemblies and those with low-standoff components removed.

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SKU: EN-2307-4 Categories: ,

Description

[07/2023]

The present paper summarizes the second part of a study dedicated to the extraction of the ionic contamination from unpopulated circuit board and electronic assemblies with low-standoff components. After investigating the influence of time, temperature and IPA/DI-water mixture on ion extraction in ion chromatography [1], the second part focuses on the evaluation of the ionic cleanliness of unpopulated boards and on a comparison of ion chromatography results between intact electronic assemblies and assemblies after removal of low-standoff components.

Author

Dr. Helmut Schweigart Head of Reliability & Surfaces, ZESTRON EUROPE Dr. Helmut Schweigart obtained his doctorate for research into the reliability of electronic sub-assemblies, and he has been employed at ZESTRON Europe since the early days of the company. He is now Head of Reliability & Surfaces Team. He is also a member of the Board of Management at GfKORR (Gesellschaft für Korrosionsschutz - a company specialising in corrosion inhibitors) as well as an active member of GUS (Gesellschaft für Umweltsimulation - an environmental simulation company) and of the IPC. He has already published numerous technical articles.
Autor Zestron FachartikelFreddy Gilbert Technology Analyst, ZESTRON EUROPE Freddy Gilbert studied material sciences at the Graduate School of engineering of the University of Montpellier and the Technical University of Berlin. In his position as Technology Analyst in the ZESTRON Reliability & Surfaces team, he organises and conducts Technology Coachings focused on failure analysis, surface analysis as well as risk assessment.

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