PCB Production / Analytics
Analytical methods such as ion chromatography, scanning electron microscopy or coating tests, etc., facilitate the verification of the reliability of an assembly in the various phases of its life cycle.
The technical articles provide insight into the various areas of application of the methods, e.g. in the clear identification of damage and the underlying failure mechanism.
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Identify and avoid causes of damage
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Increased Reliability through Ion Equivalent and Ion Chromatography
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Ion Chromatography as an Interpretation Aid for Climate Resistance Measurements
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Procedure for estimating the lifetime of a PCB under humid climate exposure
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Procedure for the risk assessment of impurities
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Quality test for susceptibility of encapsulated power electronics to harmful gas corrosion and humidity
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Selection of protective measures against climatic stress
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Verification of Ionic Contamination under Low-Standoff Components
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