Description
[03/2024]
Cleaning electronic assemblies under soldered components with low stand-off heights of 40 μm is considered a major challenge for cleaning processes, where the general aim of such process is the complete removal of flux residues. Flux residues after insufficient cleaning under components with low stand-off heights could so far only be detected by removing the components and therefore destroying the assembly.
In this study a specially developed non-destructive test with transparent assemblies is presented and used for measurement of possible shadowing phenomena spray in air (SIA) batch cleaning machines.
Specific differences in the cleaning behavior of different machine types with regard to shadowing and depending on the position in individual machines were determined and recommendations for process development were derived.
