The climatic reliability testing of electronic PCBs currently consists of several sequential serviceability tests, such as thermal cycling, salt spray, dew, harmful gas, adhesive tape removal, and operational simulation tests. The majority of these procedures involve cost-intensive equipment. The tests frequently require between three and six months to perform. This lengthy testing time in particular contradicts the rapid development times targeted and often specified for electronically controlled systems.
In the future, calculation methods for climatic PCB reliability could therefore become just as important for realising test time reduction and pre-optimisation as the calculation methods employed today for determining thermal and mechanical reliability.