The introduction of wide band gap semiconductor devices leads to smaller package sizes, higher power densities and higher switching frequencies, which is advantageous compared to the power electronics based on the conventional silicon devices. However, due to the small insulation distances and the limited temperature range of available package materials, it is not possible to exploit these advantages completely.
In this study, the properties of Parylene coatings as passivation layers in power semiconductor devices is investigated. Find out why a Parylene coating is particularly advantageous.
Dr. Helmut Schweigart
Head of Reliability & Surfaces, ZESTRON EUROPE
Dr. Helmut Schweigart obtained his doctorate for research into the reliability of electronic sub-assemblies, and he has been employed at ZESTRON Europe since the early days of the company. He is now Head of Reliability & Surfaces Team. He is also a member of the Board of Management at GfKORR (Gesellschaft für Korrosionsschutz – a company specialising in corrosion inhibitors) as well as an active member of GUS (Gesellschaft für Umweltsimulation – an environmental simulation company) and of the IPC. He has already published numerous technical articles.
Dr. Markus Meier
Senior Technology Analyst, ZESTRON EUROPE
After his study of chemistry at the Technical University Munich, Markus Meier worked among others on the ageing of cement and earned a PhD on the topic crystallization of cement-hydrate-phases under microgravity conditions. He is experienced in the areas interfacial chemistry and surface analytics. He is part of the Reliability & Surfaces Team in which he is responsible for the coordination of research projects as well as the organization of technology coachings. He has already published numerous technical articles.
Other authors: M. Sc. Sven Clausner, Dipl.-Ing. Michael Hanf, Prof. Dr.-Ing. Nando Kaminski