Within an SMT production process, most industry professionals would agree that solder paste printing is the most critical step. Many of the defects in circuit board assembly, such as excess solder or insufficient solder volumes, are a direct result of the solder paste printing process. Today, the solder paste deposition process is accomplished by printing, dispensing or most recently by jetting.
Ravi Parthasarathy, M.S.Ch.E.
Senior Application Engineer, ZESTRON Americas
Ravi Parthasarathy, M.S.Ch.E., is a Senior Application Engineer at ZESTRON Americas. As a long-standing member of IPC, SMTA, iNEMI and iMAPS, Ravi has presented numerous technical studies addressing critical cleaning challenges within the electronics manufacturing industry and is also actively involved in several IPC Task Groups.
Ravi has contributed to several case studies performed in collaboration with manufacturers of electronic assemblies, cleaning equipment providers, and solder paste suppliers. He has written and co-authored several technical articles in industry journals such as Circuits Assembly, SMT Magazine and Global SMT and Packaging.
Kalyan Nukala, M.S.Ch.E., PMP®
Application Engineer, ZESTRON Americas
Kalyan Nukala, M.S.Ch.E., PMP® is an Application Engineer at ZESTRON Americas. Mr. Nukala is an active member of the SMTA as well as the IPC. He has contributed to multiple case studies performed in collaboration with major cleaning equipment manufacturers. He was instrumental in the extensive technical paper series “DI-Water vs. Chemistry” as well as the lead-free and eutectic screening series completed at ZESTRON’s Technical and Analytical Center in Manassas, VA.