Higher Defluxing Temperature and Low Standoff Component Cleaning A Connection?

Higher Defluxing Temperature and Low Standoff Component Cleaning – A Connection?

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[Jigar Patel, Umut Tosun]

For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature.

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Description

[01/2019]

For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature.

The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material.
For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated.

Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

Author

Jigar PatelJigar Patel, M.S.Ch.E. Senior Application Engineer, ZESTRON Americas

Jigar Patel, M.S.Chem.Eng., is a Senior Application Engineer at ZESTRON Americas. Mr. Patel is an active member of the SMTA as well as the IPC. He has contributed to multiple case studies performed in collaboration with major cleaning equipment manufacturers. Mr. Patel provides technical support to ZESTRON customers, including cleaning process recommendations as well as onsite customer support for process implementations and optimizations. Mr. Patel graduated with a Bachelor’s Degree in Chemical Engineering from Shivaji University, India, and a Master’s Degree in Chemical Engineering from Wayne State University in Detroit, MI. He has been with ZESTRON since 2006.
Umut TosunUmut Tosun, M.S.Ch.E., PMP® Application Engineer, ZESTRON Americas Umut Tosun, M.S.Chem.Eng., is the Application Technology Manager at ZESTRON, the global leader in high precision cleaning products and services. Mr. Tosun has published numerous technical articles in leading electronics manufacturing magazines such as Circuits Assembly, SMT Magazine and US Tech. As an active member of the SMTA and IPC, Mr. Tosun has authored and presented numerous technical papers and studies at the industry’s largest trade shows such as the IPC/APEX and the SMTAI. Mr. Tosun holds a Bachelor of Science and Master’s Degree in Chemical Engineering from the Technical University of Hamburg, Germany. He joined ZESTRON in 2000.  

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