Flow simulation of cleaning media in narrow gaps under electronic components

» Free «

[Dr. Helmut Schweigart, Dr. Markus Meier & Co.]

Case Study: Removing chemically active solder residues from micro-gaps challenges cleaning processes and media.

Delivery form:

CompareAdded
SKU: EN-2005-01 Category:

Description

[05/2020]

Removing chemically active solder residues from micro-gaps challenges cleaning processes and media.
The objective of this study was to better understand how fluid mechanics influence the cleaning of gaps between components. To this end, external and gap flow simulations were established and the results were validated by laboratory testing. The media used in the cleaning process and the role of their material properties were considered separately in these simulations.

Author

Dr. Helmut Schweigart

Head of Reliability & Surfaces, ZESTRON EUROPE

Dr. Helmut Schweigart obtained his doctorate for research into the reliability of electronic sub-assemblies, and he has been employed at ZESTRON Europe since the early days of the company. He is now Head of Reliability & Surfaces Team. He is also a member of the Board of Management at GfKORR (Gesellschaft für Korrosionsschutz – a company specialising in corrosion inhibitors) as well as an active member of GUS (Gesellschaft für Umweltsimulation – an environmental simulation company) and of the IPC. He has already published numerous technical articles.


Dr. Markus Meier

Senior Technology Analyst, ZESTRON EUROPE

After his study of chemistry at the Technical University Munich, Markus Meier worked among others on the ageing of cement and earned a PhD on the topic crystallization of cement-hydrate-phases under microgravity conditions. He is experienced in the areas interfacial chemistry and surface analytics. At ZESTRON Europe, he works in the field of Technology Development in which he is responsible for the coordination of research projects as well as the organization of technology coachings


Co-Writer: S. Kröll, K. Költzsch

You may also like…