Description
[09/2016]
Electrochemical migration (ECM) is an important topic in terms of the reliability and life span of electronic components, and is repeatedly discussed as the possible trigger for field failures. Due to the ever increasing requirements in terms of greater packing densities/miniaturisation as well as external environmental influences, focus is being placed on field failures triggered by humidity or impurities, particularly in components that are exposed to changing environmental influences.
Author
Dr. Helmut Schweigart
Head of Reliability & Surfaces, ZESTRON EUROPE
Dr. Helmut Schweigart obtained his doctorate for research into the reliability of electronic sub-assemblies, and he has been employed at ZESTRON Europe since the early days of the company. He is now Head of Reliability & Surfaces Team. He is also a member of the Board of Management at GfKORR (Gesellschaft für Korrosionsschutz – a company specialising in corrosion inhibitors) as well as an active member of GUS (Gesellschaft für Umweltsimulation – an environmental simulation company) and of the IPC. He has already published numerous technical articles.
