Description
[09/2018]
As a follow-up to the article “Jet Printed Solder Paste an Cleaning Challenges”, this study tests a conventional no-clean flux chemistry with increasingly finer SAC305 solder powders using a variety of cleaning chemicals and methods to try to quantify the impact of finer mesh powder on flux removal.
In this white paper, you will learn what impact the finer solder powder paste deposits have on the cleaning process and materials using surface insulation resistance measure (SIR) and ion chromatography analyses.
Ravi Parthasarathy, M.S.Ch.E.
Senior Application Engineer, ZESTRON Americas
Ravi Parthasarathy, M.S.Ch.E., is a Senior Application Engineer at ZESTRON Americas. As a long-standing member of IPC, SMTA, iNEMI and iMAPS, Ravi has presented numerous technical studies addressing critical cleaning challenges within the electronics manufacturing industry and is also actively involved in several IPC Task Groups.
Ravi has contributed to several case studies performed in collaboration with manufacturers of electronic assemblies, cleaning equipment providers, and solder paste suppliers. He has written and co-authored several technical articles in industry journals such as Circuits Assembly, SMT Magazine and Global SMT and Packaging.
Kalyan Nukala, M.S.Ch.E., PMP®
Application Engineer, ZESTRON Americas
Kalyan Nukala, M.S.Ch.E., PMP® is an Application Engineer at ZESTRON Americas. Mr. Nukala is an active member of the SMTA as well as the IPC. He has contributed to multiple case studies performed in collaboration with major cleaning equipment manufacturers. He was instrumental in the extensive technical paper series “DI-Water vs. Chemistry” as well as the lead-free and eutectic screening series completed at ZESTRON’s Technical and Analytical Center in Manassas, VA.
