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  • PCB Production / AnalyticsAnalytical methods such as ion chromatography, scanning electron microscopy or coating tests, etc., facilitate the verification of the reliability of an assembly in the various phases of its life cycle. The technical articles provide insight into the various areas of application of the methods, e.g. in the clear identification of damage and the underlying failure mechanism.
  • PCB CleaningAn efficient cleaning process for assemblies and power electronics consists of the optimal combination of cleaning chemicals and equipment. However, the monitoring of the process is also crucial for its efficiency and the cleaning result. The technical articles and case studies not only provide practical tips on the procurement and monitoring of cleaning processes, but also explain factors that influence the cleaning result and further production steps (e.g. coating).
  • Protective CoatingThe coating of electronic assemblies is intended to protect them from harmful climatic environmental influences and the resulting damage and failures. But only a completely sealed protective coating can fulfil its purpose. Reliable, fast and safe tests to check the protective coating, but also the guarantee of a defect-free coating through upstream cleaning of the assemblies, are discussed in these technical articles (whitepapers).
  • Electrochemical MigrationElectrochemical migration (ECM) affects the service life and reliable functioning of electronic assemblies and is often suspected as a cause of field failures. The technical articles provide answers to questions about the origin and behaviour of the mechanism, the selection of the right protective measures and other information worth knowing about electrochemical migration.
  • Ionic ContaminationIonic contamination on assemblies or under components can significantly affect their climate resistance and, in the worst case, lead to failure. International standards (e.g. IPC J-STD 001) contain limit values for ionic contamination and specifications for their measurement. The technical articles explain practical tips on the correct implementation of the measurement methods ion equivalence measurement and ion chromatography, influences on the measurement result, the correct interpretation of results, as well as other areas of application of the methods.
  • Technical CleanlinessParticle contamination can cause short circuits or the insulation of contacts, etc. Further risks caused by particles, particle sources, an overview of norms and standards as well as measurement methods of particle loads and measures for risk minimisation are described in the technical articles.
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    PCB Cleaning: Process and result assurance, data acquisition and traceability

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    Technical Cleanliness in Electronics Manufacturing

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